The sci-tech innovation bond market continues to be hot, with issuance scale exceeding 180 billion yuan within the year

People’s Financial News, March 24 — Since the beginning of the year, the issuance scale of Sci-Tech Innovation Bonds has grown significantly and remained active, becoming an important tool in the bond market to serve technological innovation and promote “tech finance.” According to Wind data, as of March 23, based on the listing date, a total of 212 Sci-Tech Innovation Bonds have been issued this year, with an issuance scale of 181.186 billion yuan, representing year-on-year increases of 78% and 60%, respectively. (Securities Daily)

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