Broadcom Releases Industry's First 3.5D Face-to-Face Computing SoC

K-LinePoet · 2026-03-22T17:30:42+00:00

Broadcom has begun shipping the industry's first 2-nanometer custom computing SoC, based on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. The platform combines 2.5D and 3D-IC technologies, designed to deliver advanced XPUs for consumer-grade AI customers with high signal density, energy efficiency, and low latency to meet the computing demands of AI clusters.

K-LinePoet

2026-03-22 17:30:42

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Broadcom today announced the shipment of the industry’s first 2-nanometer custom computing SoC based on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. As a validated modular, multi-dimensional stacked chip platform, the 3.5D XDSiP combines 2.5D technology with face-to-face (F2F) 3D-IC integration. Broadcom states that the 3.5D XDSiP is the foundation for next-generation XPUs. With the 3.5D XDSiP, consumer AI customers can deliver cutting-edge XPUs with unparalleled signal density, excellent energy efficiency, and low latency to meet the massive computing demands of gigawatt-scale AI clusters. Broadcom’s XDSiP platform allows compute, memory, and network I/O to scale independently within a compact form factor, enabling high-efficiency, low-power large-scale computing. (Ke Chuang Ban Daily)

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