United Microelectronics Corporation (UMC) Teams With HyperLight, Jabil to Accelerate TFLN Photonics for Hyperscale AI

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United Microelectronics Corporation (UMC) has partnered with HyperLight and Jabil Inc. to advance thin-film lithium niobate (TFLN) photonics for hyperscale AI data center interconnects. This collaboration leverages HyperLight’s photonic technology, UMC’s foundry capabilities, and Jabil’s high-volume production expertise. Additionally, UMC expanded its IP licensing agreement with Adeia Inc. for semiconductor technologies like hybrid bonding, aiming to enhance flexibility for chiplet architectures in various applications.

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