Moor Thread, in collaboration with China Mobile Research Institute and others, jointly releases the 128-card high-density super node reference design

Recently, leveraging the OISA Collaborative Innovation Platform, industry partners such as Moore Thread, China Mobile Research Institute, and Zhijiang Laboratory officially released the “OISA High-Density Super Node Reference Design Technical Specification.” This specification addresses current challenges faced by intelligent computing centers, including interconnection bottlenecks, power supply pressure, and heat dissipation limits, proposing a full-stack solution that lays a key technological foundation for building autonomous, controllable, high-performance intelligent computing clusters. In the physical layout and logical topology of intelligent computing centers, the OISA high-density super node reconstructs spatial density and expansion dimensions deeply, breaking through traditional architecture barriers to computing power growth. The technical specification boldly introduces large-dimension high-density cable solutions, achieving full interconnection of 128 cards within a standard single-width cabinet based on mainstream 32- to 64-card interconnects, and supporting expansion to 256 cards through cabinet stacking, greatly optimizing computing power output per unit land area. (Moore Thread)