Hangya Technology: Plans to issue convertible corporate bonds to raise no more than 600 million RMB

2026-02-27 18:22:33

Hangya Technology announces plans to issue convertible corporate bonds to raise no more than RMB 600 million. After deducting issuance costs, the funds will be used for the Malaysian intelligent manufacturing base project for aerospace blades and medical orthopedic implant components, capacity expansion projects for aircraft engine rotating and structural parts, and to supplement working capital.

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